Electronic unit integrated into a flexible polymer body

ABSTRACT

A peel and stick electronic system comprises a silicone body, and at least one electronic unit operatively connected to the silicone body. The electronic system is produce by providing a silicone layer on a substrate, providing a metal layer on the silicone layer, and providing at least one electronic unit connected to the metal layer.

[0001] The United States Government has rights in this inventionpursuant to Contract No. W-7405-ENG-48 between the United StatesDepartment of Energy and the University of California for the operationof Lawrence Livermore National Laboratory.

BACKGROUND

[0002] 1. Field of Endeavor

[0003] The present invention relates to electronic systems and moreparticularly to a system that comprises an electronic unit integratedinto a flexible polymer body.

[0004] 2. State of Technology

[0005] Low cost components, sensors, and electronic systems aredesirable for numerous defense, consumer, and other applications. Thisincludes electronic components, sensors, electronic systems, disposableelectronic devices and methods of manufacturing them. The overall priceof a component, sensor, electronic system is determined primarily byintegration and packaging costs, not the cost of individual elements.The packaging performs two functions: it provides a means forinterconnecting various components together, and it protects delicatecomponents from the environment.

[0006] U.S. Pat. No. 5,817,550 for a method for formation of thin filmtransistors on plastic substrates to Paul G. Carey, Patrick M. Smith,Thomas W. Sigmon, and Randy C. Aceves issued Oct. 6, 1998 and assignedto Regents of the University of California provides the followingbackground information, “Recently a process was developed forcrystallizing and doping amorphous silicon on a low cost, so-calledlow-temperature plastic substrate using a short pulsed high energysource in a selected environment, without heat propagation and build-upin the substrate so as to enable use of plastic substrates incapable ofwithstanding sustained processing temperatures higher than about 180degree C.”

SUMMARY

[0007] Features and advantages of the present invention will becomeapparent from the following description. The invention provides anelectronic apparatus comprising a flexible polymer body and anelectronic unit integrated into the flexible polymer body. Applicantsare providing this description, which includes drawings and examples ofspecific embodiments, to give a broad representation of the invention.Various changes and modifications within the spirit and scope of theinvention will become apparent to those skilled in the art from thisdescription and by practice of the invention. The scope of the inventionis not intended to be limited to the particular forms disclosed and theinvention covers all modifications, equivalents, and alternativesfalling within the spirit and scope of the invention as defined by theclaims.

[0008] The present invention comprises an electronic apparatus and amethod of processing and producing an electronic apparatus. Theelectronic apparatus comprises a flexible polymer body and an electronicunit operatively connected to the flexible polymer body. The method ofprocessing and producing an electronic apparatus comprises implementinginitial processing steps on a flexible polymer body and providingelectronic components connected to the flexible polymer body.

[0009] The drawings and written description illustrate a number ofspecific embodiments of the invention. These embodiments and otherembodiments give a broad illustration of the invention. Various changesand modifications within the spirit and scope of the invention willbecome apparent to those skilled in the art. One embodiment comprises asilicone body and an electronic unit integrated into said silicone body.The electronic unit comprises various systems including, but not limitedto, a sensor, a MEMS sensor, a radio, a recorder, a recorder and player,a camera, a video camera, a video player, a video recorder, a videorecorder and player, a cell phone, a computer, a calculator, a phonetap, a device that detects phone taps, an audio surveillance device, amedical device, a biosensor, and a radiation monitor. The electronicunit also comprises various components including, but not limited to, apower source, a battery, a solar cell, wireless electronics forcommunication, a capacitor, a resistor, an inductor, a transformer, anintegrated circuit, a microprocessor, a digital to analog converter, adisplay, and other components. Another embodiment comprises a method offabricating an electronic apparatus comprising a silicone layer on asubstrate, providing a patterned metal layer on said silicone layer,providing a second layer of silicone on the flexible polymer layer, andoperatively connecting at least one electronic unit to the patternedmetal layer and the second silicone layer.

[0010] The invention is susceptible to modifications and alternativeforms. Specific embodiments are shown by way of example. It is to beunderstood that the invention is not limited to the particular formsdisclosed. The invention covers all modifications, equivalents, andalternatives falling within the spirit and scope of the invention asdefined by the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated into andconstitute a part of the specification, illustrate specific embodimentsof the invention and, together with the general description of theinvention given above, and the detailed description of the specificembodiments, serve to explain the principles of the invention.

[0012]FIG. 1 illustrates an embodiment of a system incorporating thepresent invention.

[0013]FIG. 2 illustrates an embodiment of a method of producing a systemof the present invention.

[0014]FIG. 3 is an illustration showing how a non-stick layer is appliedto a silicon handle wafer 301 and a flexible polymer layer is applied tothe non-stick layer.

[0015]FIG. 4 is an illustration showing vias that are used to produceconnections to electrical circuit lines to electronic components.

[0016]FIG. 5 illustrates another embodiment of a system constructed inaccordance with the present invention.

[0017]FIG. 6 illustrates another embodiment of a system constructed inaccordance with the present invention.

[0018]FIG. 7 illustrates a method of producing an electronic system.

[0019]FIG. 8 illustrates another embodiment of a system constructed inaccordance with the present invention.

[0020]FIG. 9 illustrates another embodiment of a system constructed inaccordance with the present invention.

[0021]FIG. 10 illustrates a method of producing an electronic system.

[0022]FIG. 11 illustrates another embodiment of a system constructed inaccordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0023] Referring now to the drawings, to the following detailedinformation, and to incorporated materials; a detailed description ofthe invention, including specific embodiments, is presented. Thedetailed description serves to explain the principles of the invention.The invention is susceptible to modifications and alternative forms. Theinvention is not limited to the particular forms disclosed. Theinvention covers all modifications, equivalents, and alternativesfalling within the spirit and scope of the invention as defined by theclaims.

[0024] The present invention comprises an electronic apparatus and amethod of processing and producing an electronic apparatus. Theelectronic apparatus comprises a flexible polymer body and an electronicunit operatively connected to the flexible polymer body. The method ofprocessing and producing an electronic apparatus comprises implementinginitial processing steps on a flexible polymer body and providingelectronic components operatively connected to the flexible polymerbody.

[0025] The drawings and written description illustrate a number ofspecific embodiments of the invention. These embodiments and otherembodiments give a broad illustration of the invention. Various changesand modifications within the spirit and scope of the invention willbecome apparent to those skilled in the art. One embodiment comprises aflexible polymer body and an electronic unit integrated into saidflexible polymer body. The invention is incorporated in various systemsincluding, but not limited to, a sensor, a MEMS sensor, a radio, arecorder, a recorder and player, a camera, a video camera, a videoplayer, a video recorder, a video recorder and player, a cell phone, acomputer, a calculator, a phone tap, a device that detects phone taps,an audio surveillance device, a medical device, a biosensor, and aradiation monitor. The invention is also incorporated into variouscomponents including, but not limited to, a power source, a battery, asolar cell, wireless electronics for communication, a capacitor, aresistor, an inductor, a transformer, an integrated circuit, amicroprocessor, a digital to analog converter, a display, and othercomponents.

[0026] Referring now to in FIG. 1, one embodiment of a systemconstructed in accordance with the present invention is illustrated. Thesystem is generally designated by the reference numeral 100. The system100 comprises a flexible polymer body 101, a first unit 102 operativelyconnected to the flexible polymer body, an additional unit 103operatively connected to the flexible polymer body, and a circuit 104integrated into the flexible polymer body connecting the first unit 102and the additional unit 103.

[0027] The system 100 provides an integrated electronic system that canbe described as a “peel and stick” sensor system. The system 100 can bevisualized as a thin, clear, and flexible unit similar to the clear“peel and stick” tags garages place on an automobile's windshield afterthe car has been serviced to remind the owner of the automobile when thenext servicing is due. The thin, clear, and flexible “peel and stick”electronic apparatus 100 can be very small and inconspicuous. Theelectronic apparatus 100 can be removed easily without leaving anyresidue behind.

[0028] The system 100 comprises a flexible polymer body 101. Theflexible polymer body can be a number of polymers whose properties aredetermined by the organic groups forming the polymer and that havecharacteristics that include one or more of being fluid, resinous,rubbery, stable in high temperatures, and hydrophobic. The flexiblepolymer body 101 shown in FIG. 1 is a silicone body. The flexiblepolymer body 101 is made of poly(dimethylsiloxane) known as PDMS. A MEMSsensor 103 is integrated into the flexible polymer body 101. MEMS orMicroElectroMechanical Systems are known as systems that containextremely small mechanical elements, often integrated together withelectronic processing circuitry. MEMS have feature sizes that aretypically measured in micrometers (microns), that is, millionths of ameter. As a reference, the diameter of human hair is about 100 microns.MEMS sensors have a wide variety of applications. For example uses ofMEMS sensors include detecting movement, detecting sound, gyroscopes,accelerometers, micro-optical systems, fiber-optic communications,super-fast electrophoresis systems for DNA separation, video projectionchips, magnetometers, micro-robots, micro-tweezers, neural probes, andmany other uses. MEMS sensors are used to detect automobile collisionsand deploy airbags, and magnetometers that can detect the presence ofmilitary equipment such as tanks, trucks or even a soldier. The tablebelow illustrates some of the uses of MEMS sensors. TABLE I TypeExamples Acceleration and Instruments, sensors and equipment forVibration Sensing producing, controlling or measuring vibratory oroscillatory motion Acoustic Sensing Sensors and instruments formeasuring and transmitting sound levels and frequency Analytical Sensorsthat are used to analyze Sensors material samples, or their components,and record data specific to the application Density and For determiningdensity and specific Specific gravity including hydrometers, digitalGravity Sensing instruments, pycnometers, etc. Displacement Detect(optical, Hall effect, inductive, Sensing etc.) or measure changes indisplacement Electrical and Devices used to detect and measureElectromagnetic electrical and electromagnetic signals Sensing Encodersand Motion feedback devices providing Resolvers position and velocityinformation to closed-loop control systems Environmental Sensorsdesigned to measure and test Sensors for changes in environmentalconditions, including radiation (both wavelength and as a hazardousemission), temperature, moisture and dew point, smoke, dust and opacity,light, weather, and water quality Flow Sensing Electronic devicesdesigned to monitor the physical flow of liquids, gases or solids; andto convert this data into electronic signals Force Sensing Instruments,sensors and equipment for measuring static or dynamic force or torqueGas Sensing Measuring the amount of a specific gas or gases in a givenenvironment Humidity and Instruments, sensors, indicators or MoistureSensing controllers for measuring humidity, moisture content and weatherconditions Level Sensing Devices used to detect or measure level ofliquids, gases or solids, within pipes or tanks, or to detect theinterfaces between different materials Linear Position Devices used tomeasure the linear Sensing displacement of an object Orientation Sensorsand instruments used to detect Position Sensing rotary position, angularposition, tilt, or inclination relative to the horizon or a linearposition Pressure Sensing Instruments and sensors for measuring orcontrolling the pressure applied to a surface from a liquid, bulkmaterial or discrete component Proximity or Sensors and Instruments forproximity Presence Sensing sensing, including capacitive, photoelectric,inductive, Hall effect, ultrasonic, and other technologies RotaryPosition Devices and instruments for sensing and Sensing measurement ofangular motion, speed, and position; includes encoders, resolvers,synchros and similar devices Temperature Devices that are designed todetect or Sensing measure changes in temperature such as temperatureprobes, sensors, etc. Tension Sensing Instruments and controllers thatmeasure, monitor or adjust tension in cable, fiber, belts, sheets andother webs Tilt Sensing Sensors or instruments that detect inclinationrelative to the horizon, rotary position, angular rates or linearacceleration Torque Sensing Instruments and controllers that measure,monitor or adjust torque in shafts, cables, fibers, rods and othercomponents Velocity Sensing Instruments and controllers that measure,monitor or adjust velocity or speed in shafts, moving webs and othercomponents Vibration and Instruments, sensors and equipment forAcceleration producing, controlling or measuring Sensing oscillatory orvibratory motion Viscosity Sensing Instruments and sensors for measuringthe viscosity or viscoelastic properties of liquid or molten glass andplastic Vision Sensing CCD, CMOS or other image capturing sensors thatform the heart of a digital camera or imaging system Weather SensingInstruments or sensors designed to measure one or multiple components ofweather; including wind speed and direction, rain/snow fall, solarradiation, temperature, pressure and humidity

Examples of some of the electronic systems that are utilized indifferent embodiments of the invention include the following:implantable medical device, radio, recorder, recorder and player, videocamera, video player, video recorder, video recorder and player, cellphone, computer, calculator, phone tap, device that detects phone taps,audio surveillance device, medical device, biosensor, radiation monitor,which include components such as a power source, battery, solar cell,wireless electronics for communication, capacitor, resistor, inductor,transformer, integrated circuit, microprocessor, digital to analogconverter, display, camera, cell phone, and other electronic devices.Discrete components such as batteries, solar cells, displays andmicroporcessors can be integrated together to form electronic systems.

[0029] Referring again to FIG. 1, the flexible polymer body comprises apoly(dimethylsiloxane) (PDMS) body 101 that serves as a polymer-basedplatform for integrating and packaging individual components. A MEMSsensor 103 is integrated into the flexible polymer body 101. A processorchip 102 is operatively connected and integrated into the flexiblepolymer body 101. A battery 105 provides power to the processor chip 102and the MEMS sensor 103. The processor chip 102 and MEMS sensor 103 areconnected by the metalization system 104. The battery 105 that providespower to the processor chip 102 and the MEMS sensor 103 is connected tothe processor chip 102 and MEMS sensor 103 by metalization system 106.An antenna 107 allows information that has been obtained by the MEMSsensor 103 to be transmitted to a remote receiver. The antenna 107 isconnected to the processor chip 102. The underside 109 of the substrateor body 101 is a peel and stick surface that can easily be affixed toother surfaces. In manufacturing, after curing the PDMS body surface 109is tacky and will stick to any clean, smooth surface such as windows,eyeglasses, monitors, cars, and a wide variety of other surfaces. Theelectronic apparatus 100 can be removed easily without leaving anyresidue behind. An adhesive may be included on the underside surface 109or the underside surface 109 may be attached to other surfaces by othermeans. The small, thin, clear, flexible, peel and stick, electronicapparatus 100 is very inconspicuous and durable. The flexible polymerbody 101 protects delicate components from the environment.Specifically, devices that are bonded to the polymer body are sealed andprotected from moisture, splashes, and water immersion. The processorchip 102 and the other components are irreversibly bonded to the PDMSsubstrate 101 to make electrical contact to the metal traces 104 and 106and seal the device 100, protecting active elements from theenvironment.

[0030] Referring now to FIG. 2, an embodiment of a method of the presentinvention is illustrated. The embodiment is designated generally by thereference numeral 200. The embodiment 200 comprises a method ofproducing the electronic system 100 shown in FIG. 1. The method 200 andthe electronic system 100 produced by the method are inexpensive. Themethod 200 provides rapid turn-around and is amenable to batchprocessing.

[0031] Low cost electronic systems and methods of producing electronicsystems are desirable for numerous defense, consumer, and otherapplications. This includes electronic components, sensors, andelectronic systems. The overall price of an electronic component,sensor, or electronic system is determined primarily by integration andpackaging costs, not the cost of individual elements. The packagingperforms two functions: it provides a means for interconnecting variouscomponents together, and it protects delicate components from theenvironment.

[0032] In step 202, a liquid pre-polymer layer is spun onto a siliconhandle wafer and cured to form a flexible polymer. A polymer is achemical compound with high molecular weight consisting of a number ofstructural units linked together by covalent bonds. The polymer used forthe flexible polymer body has characteristics that include at least oneof being fluid, resinous, rubbery, stable in high temperatures, andhydrophobic. The flexible polymer is a silicone. The silicone ispoly(dimethylsiloxane) known as PDMS. PDMS has very low waterpermeability and protects the electronic components from theenvironment. PDMS is flexible and will conform to curved surfaces. It istransparent, stretchable, resinous, rubbery, stable in high temperaturesand provides numerous applications for the electronic system 100produced by the method 200.

[0033] The silicon handle wafer provides a temporary base for productionof the electronic system 100. Silicon wafers are convenient for thehandle material because they are flat, stable, routinely used inmicrofabrication applications, and they are readily available. However,other materials such as glass, plastic, or ceramic could be used aswell. The electronic system 100 will eventually need to be removed fromthe handle wafer. Since the flexible polymer layer could adhere to thesurface of the silicon handle wafer, a non-stick layer is first providedon the silicon handle wafer.

[0034] Step 201 comprises the deposition of gold (or platinum) onto thehandle wafer. The gold film facilitates removal of the polymer membranefrom the wafer after completion of the fabrication process. A 2 mm widering at the edge of the silicon wafer is left without the gold coatingto prevent the PDMS membrane from lifting off during processing. PDMS isthen spun onto the wafer at a desired thickness and cured. For examplethe PDMS may be cured at 66° C. for 24-48 hours. It is to be understoodthat the step 201 could be omitted if the surface on which the PDMSlayer is deposited is such that the PDMS will not become bonded.

[0035] In step 203 the process of forming the electrical circuit linesand the antenna of the electronic system 100 is initiated. A photoresist(AZ®1518, Clariant) is spun onto the PDMS membrane surface at 1000 rpmfor 20 seconds and baked at 60° C. for 20 minutes. The temperature isbrought down slowly (30 min to ramp temperature down) to roomtemperature to avoid cracking in the photoresist. Prior to photoresistapplication, the wafer is placed in an oxygen plasma to activate thesurface. This allows the resist to wet the PDMS surface preventingbeading and ensuring the formation of a smooth and uniform coat ofphotoresist on the polymer surface. The substrate is placed in theoxygen plasma for 1 minute at an RF power of 100 Watts with oxygenflowing at 300 sccm. The photoresist features are then UV exposed at 279mJ and developed in AZ developer mixed 1:1 with water for 70 sec. Thenthe wafer is rinsed under a gentle stream of water and dried using N2.The wafer is placed for a second time in the oxygen plasma to activatethe newly exposed PDMS surface, and promote adhesion of the metal, whichis deposited in the next step.

[0036] In step 204 a 150 nm gold film is e-beam evaporated onto thewafer using 20 nm of titanium as the adhesion layer. Both titanium andgold are deposited at 0.2 nm per second. The e-beam needs to besufficiently cooled down before removing the parts. Cool down isconducted for 10 min. under vacuum and for 20 min. with the systemvented, but not open. The metal adheres to the PDMS surface in regionswhere the photoresist was removed, and the excess metal is removedthrough a lift-off process by placing the wafer in acetone. The wafer isthen prepared for the next step by rinsing with ethanol and dryinggently. If the PDMS surface is contaminated or aged, it can be refreshedby soaking in a 20% solution of HCl for 8 min.

[0037] In steps 205 and 206 the process of forming the vias through apassivating layer of PDMS to connect the electrical circuit lines to theelectronic components of the electronic system 100 is initiated. Aphotoresist (AZ®1518, Clariant) is spun onto the PDMS membrane surface.The photoresist via features are then patterned by exposing the resistto UV (279 mJ) through a photomask and developing in AZ developer mixed1:1 with water for 70 sec. The passivating layer of silicone is spunonto the wafer, over the patterned photoresist, then cured for twentyfour hours at 66 C. The surface is gently swabbed to remove excess PDMSfrom the top of the photoresist features before stripping the resist.This ensures the removal of the photoresist and the complete clearanceof the vias. To strip the resist the wafer is soaked in acetone for 15min., soaked in isoproponol for 5 min., and then rinsed with isoproponoland dried.

[0038] In step 207 conductive material is applied to the vias. The viascan be filled with conductive silicone adhesive, conductive ink orsolder paste. An automated dispenser or applicator machine is used todeposit precise amounts of material in the vias locations.Alternatively, the conductive material can be screen-printed usingconductive inks, or liquid ink can be injected into channels formed inthe first PDMS layer. As another option, metal can be electroplated inthe PDMS vias to form an array of electrical contacts.

[0039] In step 208, the surface of the second PDMS layer is rinsed withethanol and exposed to an oxygen plasma. This activates the surface inpreparation for bonding the electronic components to the PDMS. Thefollowing step is performed in a nitrogen environment in order to extendthe lifetime of the activated surface.

[0040] In step 209, one or more components are bonded to the PDMSsurface in order to make electrical contact and to seal and protect theunderlying surface of the devices from the environment.

[0041] In step 210 the final layer of PDMS is applied to the second PDMSlayer over the electrical components. This step is not required in allapplications. This protects delicate components from the environment.The electronic system 100 is then removed from the handle wafer. Thebottom surface of the electronic system 100 where it is removed from thehandle wafer is tacky and will stick to any clean, smooth surface suchas windows, eyeglasses, monitors, cars, and a wide variety of othersurfaces without leaving a residue. An adhesive may be included on thebody surface or the body surface may be attached to other surfaces byother means. The small, thin, clear, flexible, peel and stick,electronic apparatus 100 is very inconspicuous and durable. The PDMSbody protects delicate components from the environment without the needfor additional packaging.

[0042] Referring now to FIG. 3, an illustration is provided showing howa non-stick layer 302 is applied to a silicon handle wafer 301 and aflexible polymer layer 303 is applied to the non-stick layer. A siliconhandle wafer 301 provides a temporary base for production of theelectronic system. A non-stick layer in the form of gold or platinum isdeposited onto the handle wafer 301. This allows for removal of theflexible polymer body from the handle wafer after processing. A 2 mmwide ring at the edge of the silicon wafer is left without the goldcoating to prevent the flexible polymer membrane from lifting off thesubstrate during processing. The first flexible polymer layer 303 isspun onto the non-stick layer 302 at a desired thickness and cured. Forexample the flexible polymer may be cured at 66° C. for 24-48 hours.

[0043] Referring now to FIG. 4, an illustration is provided showing thevias that are used to form connectors for connecting the electricalcircuit lines to each other and to the electronic components of theelectronic system. A silicon handle wafer 401 is coated with a non-sticklayer 402 and a flexible polymer layer 403 is deposited on top of thenon-stick layer 402. Conductive lines 404 provide the circuits forconnecting the electrical components and the antenna 408. Vias areformed using the photoresist during manufacture to provide connectors405, 406, and 407 that are connected to the conductive lines 404. Theconnectors 405, 406, and 407 are used to provide electrical connectionto the three electrical components. The connectors 405 connect theprocessor chip. The connectors 406 connect the MEMS sensor. Theconnectors 407 connect the battery.

[0044] Referring now to in FIG. 5, another embodiment of a systemconstructed in accordance with the present invention is illustrated. Thesystem is generally designated by the reference numeral 500. The system500 comprises a flexible polymer body 501 & 502 and a resistor 503operatively connected to the flexible polymer body.

[0045] The system 500 comprises a flexible polymer body 501 & 502. Theflexible polymer body can be a number of polymers whose properties aredetermined by the organic groups and that have characteristics thatinclude one or more of being fluid, resinous, rubbery, stable in hightemperatures, and hydrophobic. The flexible polymer body unit 501comprises a polymer substrate that serves as a polymer-based platformfor integrating and packaging the resistor 503. The resistor 503 isintegrated into the flexible polymer body 501 & 502. The system 500 canprovide a wide variety of other electronic components instead of theresistor 503. For example, electronic components that can be used inplace of resistor 503 include capacitors, inductors, transformers,integrated circuits, microprocessors, digital to analog converters,displays, and other types of electronic components.

[0046] Referring now to FIG. 6, another embodiment of a systemconstructed in accordance with the present invention is illustrated. Thesystem is generally designated by the reference numeral 600. The system600 comprises a flexible polymer body 601 in the shape of a sphere. Asolar cell 602 and a MEMS sensor 603 are operatively connected insidethe spherical flexible polymer body 601. The system 600 provides adistributed sensor. The system 600 can be distributed by dropping manyof the systems 600 from a car or a plane and they will distributethemselves by bouncing around. The curved spherical polymer surfaceserves as a lens, focusing radiation from the sun onto solar cell 602.It is essentially a smart superball.

[0047] The system 600 is made of four segments. Each of the segments isa quarter sphere. The solar cell 602 and the MEMS sensor 603 arepositioned inside the spherical flexible polymer body 601. The sphericalflexible polymer body 601 is produced by assembling the four segments602, 603, 604, and 605 together.

[0048] Referring now to in FIG. 7, a method of producing the electronicsystem 600 shown in FIG. 6 is illustrated. Step 701 comprises thedeposition of gold (or platinum) onto a quarter spherical mold. Thisallows for removal of the PDMS from the mold after processing.

[0049] In step 702, a flexible polymer layer is cast into the mold. Thepolymer used for the flexible polymer body has characteristics thatinclude at least one of being fluid, resinous, rubbery, stable in hightemperatures, and hydrophobic. The flexible polymer used for the polymerbody 601 is a silicone. The silicone is poly(dimethylsiloxane) known asPDMS. PDMS has very low water permeability and protects the electroniccomponents from the environment. PDMS is flexible and can be cast intovarious shapes. It is transparent, stretchable, resinous, rubbery,stable in high temperatures and provides numerous applications for theelectronic system 600 produced by the method 700.

[0050] In step 703 the process of forming the electrical circuit linesand the antenna of the electronic system 600 is initiated. A photoresist(AZ®1618, Clariant) is spun onto the PDMS section surface at 1000 rpmfor 20 seconds and baked at 60° C. for 20 minutes and then thetemperature is brought down slowly (30 min to ramp temperature down) toroom temperature to avoid cracking in the photoresist. Prior tophotoresist application, the section is placed in an oxygen plasma tooxidize the surface. This allows the resist to wet the PDMS surfaceeliminating beading and ensuring the formation of a smooth and uniformcoat of photoresist on the polymer surface. The substrate is placed inthe oxygen plasma for 1 minute at an RF power of 100 Watts with oxygenflowing at 300 sccm. The photoresist features are then UV exposed at 279mJ and developed in AZ developer 1:1 for 70 seconds. Then the section isrinsed under a slow stream of water gently and quickly and then driedusing nitrogen. The section is placed for a second time in the oxygenplasma to activate the newly exposed PDMS surface, and promote adhesionof the metal.

[0051] In step 704 a 150 nm gold film is e-beam evaporated onto thesection using 20 nn of titanium as the adhesion layer. Both titanium andgold are deposited at 0.2 nm per second. The e-beam needs to besufficiently cooled down before removing the parts. Cool down isconducted for 10 min. under vacuum and for 20 min. with system vented,but not open. The metal adheres to the PDMS surface in the regions wherethe photoresist was removed and the excess metal is stripped through alift-off process by placing the section in acetone. The section is thenprepared for the next step by rinsing with ethanol and drying gently. Ifthe PDMS surface is contaminated or aged, it is soaked in 20% solutionof HCl for 8 min to refresh the surface.

[0052] In step 706 the process of forming the vias to connect theelectrical circuit lines to the electronic components of the electronicsystem 100 is initiated. A photoresist (AZ®1618, Clariant) is spun ontothe PDMS section surface. The photoresist vias features are then UVexposed at 279 mJ and developed in AZ developer 1:1 for 70 sec. PDMS isspun over the photoresist features and cured at 66 C for 24 hours. Thephotoresist features are gently swabbed to remove excess PDMS beforestripping the resist. This ensures the complete clearance of the viaregions. To strip the resist the section is soaked in acetone for 16min. and then soaked in isoproponol for 6 min. and then rinsed withisoproponol and dried.

[0053] In step 706 conductive material is applied to the vias. Thismaterial can be conductive silicone adhesive, conductive ink or solderpaste. An automated dispenser or applicator machine is used to depositprecise amounts of material in the via locations. Alternatively, themetal can be screen-printed or squeegeed into the vias using liquids orpastes such as conductive inks, or liquid ink can be injected intochannels formed in the first PDMS layer. As another option, metal suchas gold can be electroplated in the PDMS vias to form an array ofelectrical contacts.

[0054] In step 707 additional sections of PDMS are cast in a mold. Gold(or platinum) is deposited onto the quarter spherical mold. This allowsfor removal of the PDMS from the mold after processing.

[0055] In step 708, the surface of the additional PDMS layer is rinsedwith ethanol and exposed to an oxygen plasma. This activates the surfacein preparation for bonding the electronic components to the electroniccomponents. Bonding steps are performed in a nitrogen environment inorder to extend the lifetime of the activated surface.

[0056] In step 709, one or more components are bonded to the PDMSsurface in order to make electrical contact and to seal and protect thedevices from the environment.

[0057] In step 710, the spherical flexible polymer body 701 is producedby assembling the four segments 602, 603, 604, and 605 together. Thesolar cell 602 and the MEMS sensor 603 are located inside the sphericalflexible polymer body 601. The solar cell and MEMS sensors arecomponents bonded to the surface of one of the sections. Cavities areformed in the opposing sections to accommodate these components. Thesystem 700 provides a distributed sensor. The system 600 can bedistributed by dropping many of the systems 600 from a car or a planeand they will distribute themselves by bouncing around. The round shapeof the clear polymer body serve serves as a lens, focusing solar energyonto the solar cell 602 when it is distributed. It is essentially asmart superball.

[0058] Referring now to FIG. 8, an electrode array is illustrated. Theelectrode array is designated generally by the reference numeral 800.The electrode array 800 can be attached to the skin and can beimplanted. The electrode array comprises electrodes 802 and conductiveleads 803 operatively connected to a flexible polymer body 801. Theelectrode array 800 can conform to various shapes and the electrodearray 800 is stretchable and biocompatible. In one embodiment, thedevice has at least one electronic chip bonded to it to control theelectrical potential of the electrodes, or monitor the electricalbehavior of cells. In another embodiment sensors such as accelerometersare bonded to the device.

[0059] The electrode array 800 has many uses. For example the electrodearray 800 can be used for directly stimulating cells. The electrodearray can also be used for receiving signals from cells. The electrodearray 800 provides a system that is implantable and can be used forsurgical insertion. The electrode array 800 can be attached to thesurface of the skin or other tissue. The electrode array 800 can be usedin other ways. Other applications of the electrode array 800 include useas a flex circuit. The electrode array 800 has uses including deep brainstimulation for therapy of diseases such as Parkinsons disease, musclecontrol, audio prosthesis, a general interface between a person and acomputer, sensor, or machine, and formed biological sensors andstimulators for interfacing with the human body. These can be used forapplications ranging from disease diagnosis and therapy to sensors forvirtual reality simulators, to devices for enabling the human body toperform beyond normal capabilities, for example through IR vision, orreceiving information directly to the brain by wireless transmission.

[0060] An implantable electrode array is shown in U.S. Pat. No.4,573,481 by Leo A. Bullara, patented Mar. 4, 1986. The disclosure ofthis patent is incorporated herein in its entirety by reference. Adirectional programming for implantable electrode arrays is shown inU.S. Pat. No. 6,052,624 for by Carla M. Mann, patented Apr. 18, 2000.The disclosure of this patent is incorporated herein in its entirety byreference.

[0061] The electrode array 800 comprises a body 801 comprising at leastin part a flexible polymer. The polymer has the ability to conform tovarious shapes of the tissue. In one embodiment the polymer iscompliant. In another embodiment the polymer is silicone. In anotherembodiment the polymer is an elastomer. In another embodiment thepolymer is an elastomer that is flexible and stretchable. In anotherembodiment, the polymer is silicone rubber. In another embodiment theelastomer is poly(dimethylsiloxane) or PDMS.

[0062] Electrodes 802 are embedded in the body 801. Conductive leads 803are connected to the electrodes. The electrodes are useful forstimulating cells and recording signals from cells. In one embodimentthe electrode array transfers an electrical signal directly to thebrain. The flexible nature of the polymer allows the device to floatfreely with the brain inside the skull.

[0063] In addition to the electrode array 800, the present inventionprovides a method of fabricating a flexible electrode array. The methodcomprises the steps of providing a silicone layer on a substrate,providing a metal layer on said silicone layer, providing a second layerof silicone on said silicone layer, operatively connecting at least oneelectronic unit to said metal layer and said second silicone layer, andremoving said electronic apparatus from said substrate. In oneembodiment, a handle wafer is coated with metal to prevent adhesion ofthe silicone to the handle wafer. The first silicone layer is deposited.A second metal layer is deposited and patterned. Then the next PDMSlayer is deposited and patterned to expose the conductive seed layer toform electrodes. The electrodes are either electroplated from the seedlayer, or deposited in the form of conductive ink or paste. Oneembodiment includes the step of directly embedding an electricalconnector into the device to interface with electronics. Anotherembodiment includes the step of spin-coating or casting a PDMS cappinglayer on to the first PDMS layer. Another embodiment includes the stepof bonding a PDMS capping layer to the first PDMS. In one embodiment themetal electrodes are biocompatible. In another embodiment the electrodesare gold. In another embodiment the electrodes are platinum. In anotherembodiment, the electrodes are iridium. In another embodiment, theelectrodes are iridium oxide. In another embodiment the electrodes aremade of a conductive polymer material. In another embodiment, theelectrodes are made of conductive ink or paste form of carbon, platinum,iridium, or iridium oxide particles bound by a polymer or epoxy matrix.In another embodiment, the electrodes are made of conductive ink orpaste formed of a combination of conductive particles in a polymer orepoxy matrix. In another embodiment a pre-patterned or formed PDMS layeris cast in place with a mold. In another embodiment the electrodes areelectroplated using gold. In another embodiment the electrodes areelectroplated using platinum. In another embodiment the electrodes areelectroplated using iridium. In another embodiment the electrodes areelectroplated using iridium oxide. In another embodiment a pre-patternedor formed PDMS layer is bonded to the handle wafer. In anotherembodiment a step of patterning conducting lines on the PDMS isperformed. The conducting lines are patterned using a combination ofthin film deposition and photolithography. In another embodiment thestep of patterning conducting lines on the PDMS is conducted usingphotolithography. In another embodiment the step of patterningconducting lines on the PDMS is conducted using shadow masking. Inanother embodiment, the step of patterning conducting lines on the PDMSis conducted using screen printing techniques to selectively applyconductive ink or paste. An embodiment includes doping the PDMS withmetal or other conducting particles to selectively render it conductive.An embodiment includes removing the PDMS from the handle wafer.

[0064] The flexible electrode array 800 is produced by implementingvarious processing steps on a substrate. A conductive material isdeposited on a handle wafer and various processing steps are taken tocomplete the flexible electrode array 800. The flexible electrode arrayincludes a poly(dimethylsiloxane) or PDMS (a form of silicone rubber)substrate with embedded electrodes 802 and conductive leads 803. Thesubstrate is initially positioned on a handle wafer. The electrodesystem can be constructed using a combination of electroplating, andscreen printing, and deposition, and patterning of the thin film metalson PDMS.

[0065] Electrode Fabrication Process

[0066] 1. Deposit gold (or platinum) onto a handle wafer, preferablyround wafers to make later processing steps easier. The gold layerallows for removal of the PDMS from the substrate after processing.

[0067] 2. Mix PDMS 10:1 ratio resin to curing agent. Mix well and degas.

[0068] 3. Spin on first PDMS layer.

[0069] 4. Cure PDMS 24 hrs at 66° C.

[0070] 5. Allow PDMS to cool.

[0071] 6. Patterning Conductive Metal Lines Using Lift-Off Process (See“Process for Patterning Conductive Metal Lines Using Lift-Off Process”below).

[0072] 7. Spin on thick photoresist.

[0073] 8. Expose through mask and develop to produce the patternedphotoresist.

[0074] 9. Mix PDMS 10:1 ratio resin to curing agent. Mix well and degas.Activate the surface of the first PDMS layer in an oxygen plasma.

[0075] 10. Spin on or cast desired thickness of PDMS onto the patternedphotoresist on the handle wafer.

[0076] 11. Let PDMS settle at room temperature before curing. Thisallows PDMS to separate from the photoresist.

[0077] 12. Cure PDMS 1 hr at 66° C.

[0078] 13. Allow PDMS to cool.

[0079] 14. Remove remaining photoresist using acetone. This results in apatterned PDMS layer on top of the handle wafer with a partially exposedmetal seed layer.

[0080] 15. Electroplate gold or platinum through the patterned PDMS toform electrodes and contacts for electronic chips and other components.

[0081] Process for Patterning Conductive Metal Lines Using Lift-OffProcess

[0082] 1. Oxidize the PDMS surface for 1 min. at 100 watts RF power.

[0083] 2. Spin on AZ1518 Photoresist at 1000 rpm for 20 sec.

[0084] 3. Soft bake the resist at 60° C. for 10 min then bring downtemperature to 45° C. for 10 min and then bring down temperature to 30°C. for 10 min. (Lowering the temperature slowly minimizes cracking inthe photoresist).

[0085] 4. Expose for 15 sec. through mask.

[0086] 5. Develop in AZ developer for approximately lmin.

[0087] 6. Deposit metal using electron-beam evaporator.

[0088] 7. Deposit 200 angstroms of titanium as the adhesion layer at 2angstroms/sec.

[0089] 8. Deposit 1000 angstroms of gold as the conductive metal at 2angstroms/sec. Platinum can be used as an alternative to gold.

[0090] 9. Deposit 200 angstroms of titanium on top of the gold toprovide an adhesion layer for the 2nd PDMS layer that will be depositedlater.

[0091] 10. Following metal deposition place in acetone to remove excessmetal through a lift-off process, but do not shake or stir as this maycause the PDMS to lift off of the substrate. Apply PDMS around the edgesof the wafer to ensure that the PDMS membrane remains attached to thesubstrate.

[0092] 11. Gently rinse with acetone and isopropyl alcohol and set on aflat surface. Air dry.

[0093] Referring now to in FIG. 9, another embodiment of a systemconstructed in accordance with the present invention is illustrated. Thesystem is generally designated by the reference numeral 900. The system900 comprises a flexible polymer body 902 & 904 and a capacitor 903operatively connected to the flexible polymer body. The system 900provides an integrated electronic system that can be described as a“peel and stick” electronic component system. The system 900 can bevisualized as a thin, clear, and flexible unit similar to the clear“peel and stick” tags garages place on an automobile's windshield afterthe car has been serviced to remind the owner of the automobile when thenext servicing is due. The thin, clear, and flexible “peel and stick”electronic apparatus 900 can be very small and inconspicuous.

[0094] The system 900 comprises a flexible polymer body 902 & 904. Theflexible polymer body can be a number of polymers whose properties aredetermined by the organic groups and that have characteristics thatinclude one or more of being fluid, resinous, rubbery, stable in hightemperatures, and hydrophobic. The flexible polymer body unit comprisesa polymer substrate 902 that serves as a polymer-based platform forintegrating and packaging the electronic components 903. The electroniccomponents 903 are integrated into the flexible polymer body. Theunderside of the substrate unit 902 is a peel and stick surface that caneasily be affixed to other surfaces. In manufacturing, after curing thePDMS body surface is tacky and will stick to any clean, smooth surfacesuch as electrical equipment, circuit boards, and a wide variety ofother surfaces. An adhesive may be included on the underside surface orthe underside surface may be attached to other surfaces by other means.The small, thin, clear, flexible, peel and stick, electronic apparatus900 is very inconspicuous and durable. The flexible polymer bodyprotects the electronic components 903 from the environment. The system900 can provide a wide variety of other electronic components instead ofthe capacitor 903. For example, electronic components that can be usedin place of capacitor 903 include resistors, inductors, transformers,integrated circuits, microprocessors, digital to analog converters,displays, and other types of electronic components.

[0095] Referring now to in FIG. 10, a method of producing the electronicsystem 900 shown in FIG. 9 is illustrated. In step 1001 (ProvideSubstrate for Subsequent Processing), a substrate for subsequentprocessing is provided. The substrate may be a handle wafer, a mold, orother form for subsequent processing steps. A silicon handle wafer is aconvenient substrate because it is flat, stable, routinely used inmicrofabrication applications, and is readily available. Other materialssuch as glass, plastic, or ceramic could be used as well.

[0096] In step 1002 (First Flexible Polymer Layer Applied to Substrate),a first flexible polymer layer is applied to the substrate. Before thefirst flexible polymer layer is applied, a titanium/gold layer can bedeposited onto the substrate if it is glass or silicone to preventadhesion of the polymer. The polymer used for the first flexible polymerlayer and the second flexible polymer layer has characteristics thatinclude at least one of being fluid, resinous, rubbery, stable in hightemperatures, and hydrophobic. The flexible polymer used as polymerlayers of the electronic apparatus 900 is a silicone. The silicone ispoly(dimethylsiloxane) known as PDMS is one form of silicone. PDMS hasvery low water permeability and protects the electronic components fromthe environment. PDMS is flexible and will conform to curved surfaces.It is transparent, stretchable, resinous, rubbery, stable in hightemperatures and provides numerous applications for the electronicsystem 900 produced by the method 1000.

[0097] In step 1003 (Photoresist on the First Flexible Polymer Layer andPatterned), the process of forming the electrical circuit lines thatform the capacitor of the electronic system 900 is initiated.

[0098] A photoresist (AZ®1518, Clariant) is spun onto the PDMS membranesurface at 1000 rpm for 20 seconds and baked at 60° C. for 20 minutes.The temperature is brought down slowly (30 min to ramp temperature down)to room temperature to avoid cracking in the photoresist. Prior tophotoresist application, the wafer is placed in an oxygen plasma toactivate the surface. This allows the resist to wet the PDMS surfacepreventing beading and ensuring the formation of a smooth and uniformcoat of photoresist on the polymer surface. The substrate is placed inthe oxygen plasma for 1 minute at an RF power of 100 Watts with oxygenflowing at 300 sccm. The photoresist features are then UV exposed at 279ml and developed in AZ developer mixed 1:1 with water for 70 sec. Thenthe wafer is rinsed under a gentle stream of water and dried using N2.The wafer is placed for a second time in the oxygen plasma to activatethe newly exposed PDMS surface, and promote adhesion of the metal, whichis deposited in the next step.

[0099] In step 1004 (First Metal Layer Deposited onto the PatternedFirst Flexible Polymer Layer) A 150 nm gold film is e-beam evaporatedonto the wafer using 20 nm of titanium as the adhesion layer. Bothtitanium and gold are deposited at 0.2 nm per second. The e-beam needsto be sufficiently cooled down before removing the parts. Cool down isconducted for 10 min. under vacuum and for 20 min. with the systemvented, but not open. The metal adheres to the PDMS surface in regionswhere the photoresist was removed, and the excess metal is removedthrough a lift-off process by placing the wafer in acetone. The wafer isthen prepared for the next step by rinsing with ethanol and dryinggently. If the PDMS surface is contaminated or aged, it can be refreshedby soaking in a 20% solution of HCl for 8 min.

[0100] In step 1005 (Second Flexible Polymer Layer Applied Over FirstMetal Layer and First Flexible Polymer Layer), a second layer of PDMS isapplied over the first flexible polymer layer and the electrical circuitlines that connect to the capacitor. PDMS is flexible, transparent,stretchable, resinous, rubbery, stable in high temperatures, andprovides numerous applications for the electronic system 900 produced bythe method 1000. The final step is to bond on the capacitor and otherelectrical components.

[0101] Referring now to in FIG. 11, another embodiment of a systemconstructed in accordance with the present invention is illustrated. Thesystem is generally designated by the reference numeral 1100. Integratedmicrosystems will play an increasingly important role in HomelandSecurity applications. Examples include microfluidic systems forchemical and biological threat detection, distributed sensors fortracking terrorist activities, radiation detectors, and cargo containermonitoring devices. These applications require small, low cost, rugged,field-operable devices. Deployable sensors with wireless communicationcapability are required for numerous counter-terrorism and intelligenceapplications. Examples include monitoring cargo shipments, trackingtroop, individual personnel, and vehicle movement, and detectingchemical and biological signatures associated with various threats.These sensor modules must meet several requirements for widespreaddeployment. They need to be inexpensive, rugged for air-drop deploymentand abusive conditions, inconspicuous, able to withstand severeenvironmental factors (temperature extremes, water submersion), andself-sufficient (integrated power, electronics, sensing, andcommunications).

[0102] The system 1100 comprises a PDMS body 1101, an optical sensor1102 operatively connected to the PDMS body 1101, a microfluidic channel1103 operatively connected to the PDMS body 1101, a MEMS sensor 1105operatively connected to the PDMS body 1101, and an Application-SpecificIntegrated Circuit (ASIC) 1107 operatively connected to the PDMS body1101. Metal traces 1106 are integrated into the PDMS body 1101 thatconnect the optical sensor 1102, the Application-Specific IntegratedCircuit 1107, and the MEMS sensor 1105. An antenna 1104 facilitatescommunication with a remote receiver.

[0103] The underside of the substrate unit 1101 is a peel and sticksurface that can easily be affixed to other surfaces. In manufacturing,after curing the PDMS body surface is tacky and will stick to any clean,smooth surface such as electrical equipment, circuit boards, and a widevariety of other surfaces. An adhesive may be included on the undersidesurface or the underside surface may be attached to other surfaces byother means. The small, thin, clear, flexible, peel and stick,electronic apparatus 1100 is very adaptable and durable. The flexiblepolymer body protects the components from the environment.

[0104] The system 1100 provides an integrated electronic system that canbe described as a “peel and stick” electronic component system. Thesystem 1100 can be visualized as a thin, clear, and flexible unitsimilar to the clear “peel and stick” tags garages place on anautomobile's windshield after the car has been serviced to remind theowner of the automobile when the next servicing is due. The thin, clear,and flexible “peel and stick” electronic apparatus 110 can be very smalland adaptable.

[0105] The system 1100 comprises a polymer-based platform that willenable the development of hybrid Microsystems with integrated sensors,electronics, optical elements, power, and microfluidics. The platform iscapable of incorporating off-the-shelf components as well as customfabricated devices, and features a low cost packaging approach.Polydimethylsiloxane (PDMS) serves as the integration backbone, withmicrofluidic structures molded into the silicone polymer, and othercomponents such as silicon sensors and circuits directly bonded to thePDMS, forming a leak-proof seal. Electrical traces are patterned on thePDMS to interconnect the various components. The ACIC chip 1107 and theother components are irreversibly bonded to the PDMS substrate 1101 tomake electrical contact to the metal traces 1106 and seal the device1100, protecting active elements from the environment.

[0106] While the invention may be susceptible to various modificationsand alternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

The invention claimed is:
 1. An electronic apparatus, comprising: asilicone body, and at least one electronic unit operatively connected tosaid silicone body.
 2. The electronic apparatus of claim 1 wherein saidat least one electronic unit comprises a sensor.
 3. The electronicapparatus of claim 1 wherein said at least one electronic unit comprisesa MEMS sensor.
 4. The electronic apparatus of claim 1 wherein said atleast one electronic unit comprises a resistor.
 5. The electronicapparatus of claim 1 wherein said at least one electronic unit comprisesa capacitor.
 6. The electronic apparatus of claim 1 wherein said atleast one electronic unit comprises an integrated circuit.
 7. Theelectronic apparatus of claim 1 wherein said at least one electronicunit comprises a microprocessor.
 8. The electronic apparatus of claim 1wherein said at least one electronic unit comprises an electrode array.9. The electronic apparatus of claim 1 wherein said at least oneelectronic unit comprises a display.
 10. The electronic apparatus ofclaim 1 wherein said at least one electronic unit comprises a powersource.
 11. The electronic apparatus of claim 1 wherein said at leastone electronic unit comprises a solar cell.
 12. The electronic apparatusof claim 1 wherein said at least one electronic unit comprises abattery.
 13. The electronic apparatus of claim 1 wherein said at leastone electronic unit comprises a neural probe.
 14. The electronicapparatus of claim 1 wherein said at least one electronic unit comprisesa light emitting diode.
 15. The electronic apparatus of claim 1 whereinsaid at least one electronic unit forms a system and the systemcomprises a computer.
 16. The electronic apparatus of claim 1 whereinsaid at least one electronic unit forms a system and the systemcomprises a radio.
 17. The electronic apparatus of claim 1 wherein saidat least one electronic unit forms a system and the system comprises atelevision.
 18. The electronic apparatus of claim 1 wherein said atleast one electronic unit forms a system and the system comprises amagnetometer.
 19. The electronic apparatus of claim 1 wherein saidsilicone body comprises a poly(dimethylsiloxane) body.
 20. Theelectronic apparatus of claim 1 wherein said silicone body is a thinflat silicone body.
 21. The electronic apparatus of claim 1 wherein saidsilicone body is a spherical silicone body.
 22. The electronic apparatusof claim 1 wherein said silicone body is a transparent sphericalsilicone body containing a solar cell and a MEMS sensor.
 23. Theelectronic apparatus of claim 1 wherein said silicone body includes amounting surface.
 24. The electronic apparatus of claim 23 wherein saidmounting surface is produced in the process of producing said electronicapparatus.
 25. The electronic apparatus of claim 23 wherein saidmounting surface includes means for connecting said mounting surface toan external surface.
 26. The electronic apparatus of claim 25 whereinsaid means for connecting said mounting surface to an external surfacecontains an adhesive.
 27. The electronic apparatus of claim 1 whereinincluding metal traces operatively connected to said silicone body andsaid at least one electronic unit and wherein said at least oneelectronic unit is irreversibly bonded to said silicone body to makeelectrical contact between said at least one electronic unit and saidmetal traces and to seal said electronic apparatus.
 28. The electronicapparatus of claim 1 wherein said at least one electronic unit comprisesan implantable medical device.
 29. The electronic apparatus of claim 28wherein said implantable medical device comprises a stimulatingelectrode array.
 30. The electronic apparatus of claim 28 wherein saidimplantable medical device comprises a recording electrode array. 31.The electronic apparatus of claim 28 wherein said at least oneelectronic unit comprises integrated microfluidics for drug delivery inimplant applications or chemical or biological sensing applications. 32.An electronic apparatus, comprising: a silicone body, a first unitintegrated into said silicone body, at least one additional unitintegrated into said silicone body, and a circuit integrated into saidsilicone body connected to said first unit and connected to said atleast one additional unit.
 33. The electronic apparatus of claim 32wherein said circuit is an electronic circuit.
 34. The electronicapparatus of claim 32 wherein said first unit is an electroniccomponent.
 35. The electronic apparatus of claim 32 wherein said firstunit is a sensor.
 36. The electronic apparatus of claim 32 wherein saidfirst unit is a MEMS sensor.
 37. The electronic apparatus of claim 32wherein said silicone body comprises a poly(dimethylsiloxane) body. 38.The electronic apparatus of claim 32 wherein said silicone body includesa mounting surface and wherein said electronic apparatus includes meansfor connecting said mounting surface to an external surface.
 39. Theelectronic apparatus of claim 32 wherein said silicone body includes amounting surface and wherein said electronic apparatus includes meansfor connecting said mounting surface to an external surface and saidmounting surface contains an adhesive.
 40. The electronic apparatus ofclaim 32 wherein said silicone body is a thin flat silicone body. 41.The electronic apparatus of claim 32 wherein said silicone body is aspherical silicone body.
 42. The electronic apparatus of claim 32wherein said silicone body is a transparent spherical silicone bodycontaining a solar cell and a MEMS sensor.
 43. A method of fabricatingan electronic apparatus, comprising the steps of: providing a siliconelayer on a matrix, providing a metal layer on said silicone layer,providing a second layer of silicone on said silicone layer, providingat least one electronic unit connected to said metal layer, and removingsaid electronic apparatus from said matrix.
 44. The method offabricating an electronic apparatus of claim 43 wherein said siliconelayer and said second layer of a silicone comprisepoly(dimethylsiloxane).
 45. The method of fabricating an electronicapparatus of claim 43 wherein said silicone layer and said second layerof a silicone provide a thin flat polymer body.
 46. The method offabricating an electronic apparatus of claim 43 wherein said siliconelayer and said second layer of a silicone provide a spherical siliconebody.
 47. The method of fabricating an electronic apparatus of claim 43wherein said silicone layer and said second layer of a silicone providea transparent spherical silicone body containing a solar cell and a MEMSsensor.
 48. The method of fabricating an electronic apparatus of claim43 wherein said at least one electronic unit comprises a MEMS sensor.49. The method of fabricating an electronic apparatus of claim 43wherein said at least one electronic unit comprises an electrode array.50. The method of fabricating an electronic apparatus of claim 43wherein said step of removing said electronic apparatus from said matrixprovides a tacky surface on said electronic apparatus.
 51. The method offabricating an electronic apparatus of claim 45 including the step ofusing said tacky surface to attach said electronic apparatus to anexternal surface.
 52. The method of fabricating an electronic apparatusof claim 43 including the step of attaching said electronic apparatus toan external surface.
 53. The method of fabricating an electronicapparatus of claim 43 including the step of attaching said electronicapparatus to eyeglasses.
 54. The method of fabricating an electronicapparatus of claim 43 including the step of implanting said electronicapparatus.
 55. The method of fabricating an electronic apparatus ofclaim 43 including the step of distributing said electronic apparatus.56. The method of fabricating an electronic apparatus of claim 43including the step of distributing said electronic apparatus bydistributing said electronic apparatus from an aircraft.
 57. The methodof fabricating an electronic apparatus of claim 43 including the step ofdistributing said electronic apparatus by distributing said electronicapparatus from a vehicle.